Silicon photonics (SiPh) offers a high degree of integration and cost-effectiveness, helping to enhance optical module performance while driving down costs. Coherent technology facilitates long-distance, high-speed transmission with exceptional signal quality. The Printed Circuit Board (PCB) at the heart of these modules is no longer a simple substrate but a highly engineered system. Designing and producing these complex PCBs presents formidable challenges, requiring a convergence of disciplines—from high-frequency signal integrity and advanced thermal. In an optical communication system, various advanced technologies such as digital coherence, DWDM (Dense Wavelength Division Multiplexing), and ROADM (Reconfigurable Optical Add-Drop Multiplexer) have been introduced to realize power-savings and to improve the economics of high-speed and. At present, the world's AI large-scale models have been released one after another and combined with industry applications to promote the smart upgrade of thousands of industries, and continue to drive the demand for optical chips, optical devices, and optical module in the upstream of the data. Silicon photonics (SiPh) offers a high degree of integration and cost-effectiveness, helping to enhance optical module performance while driving down costs. Linear drive pluggable optics (LPO). form factor modules, the manufacturing process is based on UV lens molding at wafer level. Whereas alternative lithography methods are limited in their ability to manufacture complex optical structures at wafer level, nanoimprint lithography (NIL) and lens molding re insensitive to shape and. According to YOLE's prediction, the global market size for optical modules will increase from $10. 7 billion in 2027, with a compound annual growth rate of 15%. As optical modules evolve from 400Gbps to 800Gbps and then to 1. 6Tbps, they drive the development of appropriate.