The fabrication and assembly of 3D optical modules based on active interposer-integrated edge couplers and TSV are realized in this paper. Different active interposer processes with integrated edge couplers and RDL-TSV-RDL structures are discussed, manufactured, analyzed and. Traditional high-speed interconnect solutions typically rely on digital signal processors (DSP) and clock data recovery circuits (CDR) to perform signal equalization, retiming, and compensation to counteract attenuation and distortion during long-distance electrical transmission. Photonic integrated circuits have progressed slowly, but when these. Substantial effort has been expended to design an appropriate optical interconnection scheme between the electrical devices mounted on a printed circuit board, due to the faster speed of transmission of an optical signal in comparison to the speed of an electrical signal within a conductor, and the. The Printed Circuit Board (PCB) at the heart of these modules is no longer a simple substrate but a highly engineered system. Designing and producing these complex PCBs presents formidable challenges, requiring a convergence of disciplines—from high-frequency signal integrity and advanced thermal. Three-dimensional integration based on active photonic interposers can achieve the advantages of high integration, high bandwidth and low power consumption, which has become the main direction for next generation optical module technology.