Latest Updates Optical Interconnect Technology Analysis: LPO, NPO, CPO
To overcome these limitations, a new generation of optical interconnect technologies has emerged. LPO (Linear-drive Pluggable Optics),
Latest Updates Intel CPU with Optical Compute Interconnect Chiplet
Although Intel sold its Silicon Photonics pluggable business to Jabil, the company still has a SiPho team that is showing off its new optical interconnect
Latest Updates Intel''s OCI-Compatible Chiplet Provides 64 Optical
Intel''s Integrated Photonics Solutions (IPS) Group demonstrated a fully integrated optical compute interconnect (OCI) chiplet co-packaged with an
Latest Updates Next-Gen Optics Need Next-Gen Materials: CPO
As data centers continue to evolve, Co-Packaged Optics (CPO) technology is gradually replacing traditional pluggable optical modules, emerging
Latest Updates Nvidia outlines plans for using light for communication
Nvidia will introduce CPO-based optical interconnection platforms both for Ethernet and InfiniBand technologies. First, the company plans to
Latest Updates Intel shows OCI optical I/O chiplet co-packaged with
Explosive AI infrastructure growth is bringing high bandwidth density and low power performance requirements to compute architectures which optical
Latest Updates Marvell Announces Breakthrough Co-Packaged Optics
Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators New Marvell AI accelerator (XPU) architecture enables
Latest Updates WORLD WIDE WEB JOURNAL Home
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Latest Updates IBM Brings the Speed of Light to the Generative AI Era
IBM has unveiled breakthrough research in optics technology that could dramatically improve how data centers train and run generative AI models.
Latest Updates Intel says its optical chiplet can pump 4 Tbps between
Intel has demonstrated an optical chiplet co-packaged with a CPU capable of supporting 4 Tbps data links to feed the increasing datacenter
Latest Updates Speeding AI Compute, Intel Debuts First Integrated
Intel''s new chiplet co-packages these optical transceivers with the CPU on a single substrate, reducing the physical distance between the CPU and the
Latest Updates Intel® Shows OCI Optical I/O Chiplet Co-packaged with
Christian Urricariet is Head of Product Marketing for Silicon Photonics at Intel. At the Optical Fiber Conference (OFC) in San Diego on March 26-28,
Latest Updates Breakthrough optical processor lets AI compute at the
Researchers at Tsinghua University developed the Optical Feature Extraction Engine (OFE2), an optical engine that processes data at 12.5 GHz
Latest Updates Semiconductor & System Solutions | Infineon Technologies
The latest news & events Discover technology changing the world Wherever the world is changing – technology plays a crucial role. Learn how the technological key trends energy, mobility & IoT are
Latest Updates What exactly is the mechanism behind ''EU
Optical, thermal, and mechanical parameters are linked between each module, and hundreds of CPUs, FPGAs, and dedicated AI chips are used to
Latest Updates The Rise of Co-Packaged Optics: A Deep Dive into CPO
A CPO optical module integrates optical and electronic components to boost data center speed, efficiency, and bandwidth while reducing power use.
Latest Updates Supply Chain & Distribution Archives
Proactively manage semiconductor obsolescence with early insights and trusted partners to avoid redesigns and keep your supply chain secure.
Latest Updates Five Key Trends of Co-Packaged Optics (CPO) in 2026
These pressures are driving renewed momentum behind co-packaged optics (CPO). According to LightCounting, sales of lasers and photonic integrated
Latest Updates Electronic Chip Package and Co-Packaged Optics
Meanwhile, the optical module, enabled by silicon photonics, is now treated similarly to electronic chips, and advanced co-packaged optics (CPO) is
Latest Updates Embedded Optical Transmission Tech, Arrival of CPO Set to Deliver
The implementation of semiconductor architectures with embedded optical interconnect (I/O) technologies is gaining traction this year. The shift from copper to optical technologies will bring more
Latest Updates Co-Packaged Optics — a deep dive | APNIC Blog
The optical engine of a transceiver — whether co-packaged or part of a pluggable module — typically includes an electronic integrated circuit (EIC) and
Latest Updates Co-packaged optics can supercharge generative AI computing
Scientists at IBM Research have announced a new set of advancements in chip assembly and packaging, called co-packaged
Latest Updates Can Arista''s Latest XPO Optical Modules for AI Networks Drive Growth?
ANET unveils liquid-cooled XPO optical modules delivering 12.8 Tbps each, boosting rack capacity 4x for AI data centers needing extreme bandwidth and efficiency.
Latest Updates Intel Showcases Optical-Interconnect Chiplet
Intel''s OCI chiplet As with some products being pursued by other companies, Intel''s newly unveiled OCI chiplet attempts to reduce this “I/O tax” by
Latest Updates Co-packaged Optics: all eyes on high-performance
Since it is challenging with today''s technology to surround the 50T switch chip with 16 3.2Tbps optical modules, NPO tackles this by using a high-performance PCB
Latest Updates Nvidia outlines plans for using light for communication
Improvements of CPOs compared to pluggable modules are dramatic, according to Nvidia: a 3.5-times increase in power efficiency, a 64 times
Latest Updates Intel Demonstrates First Fully Integrated Optical I/O Chiplet
At the Optical Fiber Communication Conference (OFC) 2024, Intel''s Integrated Photonics Solutions (IPS) Group demonstrated the industry''s most
Latest Updates Where co-packaged optics (CPO) technology stands in
Find out CPO''s 2025 scorecard and what lies ahead for this optical interconnect technology in 2026 and beyond.
Latest Updates Intel launches optical compute interconnect chiplet:
The optical compute interconnect (OCI) chiplet can be attached to CPUs and GPUs to enable high bandwidth, low power consumption, and
Latest Updates How Industry Collaboration Fosters NVIDIA Co
NVIDIA is developing a co-packaged optics (CPO) platform that integrates optical and electrical components to improve data-center connectivity,